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Characteristics Of Laser Marking Machine
Nov 13, 2017

"Hot processing" has a high energy density of the laser beam (it is a concentrated energy flow), irradiated on the surface of the processed material, the material surface absorbs the laser energy and generates the heat excitation process in the irradiation area, which causes the temperature of the material surface (or coating) to rise, resulting in abnormal, melting, ablation and evaporation phenomena.

"Cold processing" has a very high load energy (ultraviolet) photon, can interrupt the material (especially organic materials) or the chemical bonds in the surrounding medium, to cause the material to occur the non thermal process damage. This cold processing in the laser marking process has a special significance, because it is not a thermal ablation, but does not produce "thermal damage" side effects, interrupted the cold stripping of chemical bonds, and thus the surface of the processed surfaces and adjacent areas do not produce heating or thermal deformation and so on. For example, the electronic industry uses excimer lasers to deposit chemical films on substrate materials and narrow grooves on semiconductor substrates.